Wicking means that the solder flows up the leads of the component or along the traces, and may flow under the insulating layer and through holes. It will take away the solder from the interconnection, usually caused by uneven heating between the connected materials This is rarely observed in hot-air convection dominated reflow, and it is a feature in older infrared dominated reflow and gas phase technologies. Solder resist can be used to control the flow of solder along the flux. Appropriate heating methods, especially in Preheating control is a way to solve the difference in heat.