Insufficient solder

2021-07-08 10:06:32

Incomplete solder joints can cause open circuits or poor interconnections.

Reasons related to process and design:

• Non-coplanar leads on components

• Excessive warpage of PCB or substrate

• Poor wetting

• Due to incorrect printing parameters, insufficient amount of solder

• Due to the blockage of the template hole, the printed solder skips and leaks

• Misalignment of solder printing

• Improper template thickness

• Insufficient template hole size

• Land size is too large

• Vias in the pad can drain the solder in the interconnect

Reflow related reasons

• Preheating is too aggressive

• The peak reflow (solder paste liquefaction) temperature is not reached

• Failure of the reflow oven prevents the attenuation of the proper temperature

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