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HELLER Semiconductor Horizontal Reflow Soldering has issued a world-class standard for more than 8 years, providing the most standard reflow oven requirements, suitable for 95% of the reflow oven requirements, multi-temperature zone design, easier to
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The ELLER pressure oven is suitable for low voids and increased adhesive strength requirements in the bonding process, as well as a wide range of applications in the wafer packaging and filling process
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1 Suitable for large size high requirements ultra-low oxygen concentration products world-class horizontal reflow wel
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HELLER Industries has developed fluxless reflow which utilizes Formic Acid (HCOOH) to replace standard flux agents
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