Suzhou Renen Electromechanical Technology Co , Ltd was established in 2021 to provide customers with integrat
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Key Advances in Void Reduction in the Reflow ProcessUsing Multi-Stage Controlled VacuumThis paper explores new adva
———— 2021-08-09
Process upgrade 1 0: from plasma to laser Before the popularization of laser applications, carbon steel m
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Early fiber lasers were low in efficiency, low power, and limited, until a more effective method of deliver
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Incomplete solder joints can cause open circuits or poor interconnections Reasons related to process and design:&bul
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Wicking means that the solder flows up the leads of the component or along the traces, and may flow under
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A solder ball is a small solder powder that is separated from the main body of the solder joint Too muc
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The reflow profile must meet the specific requirements of solder paste and the critical value of heat treat
———— 2021-07-08CONTACT
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